Радиокомпоненты по запросу

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DC-DC, 5Вт, Uвх=9 - 18В, Uвых=5В/1А, изоляция 1500В DC, DIP24, -25°С…+71°С, без сертификатов
595110405
 
DC-DC, 5Вт, Uвх=9 - 18В, Uвых=5В/1А, изоляция 1500В DC, DIP24, -25°С…+71°С, без сертификатов
595110406
 
DC-DC, 5Вт, Uвх=9...36В, Uвых=5В/1А, изоляция 1500В DC, DIP24, -40…+71°С
595110407
 
DC-DC, 5Вт, Uвх=9...36В, Uвых=12В/500мА, изоляция 1500В DC, DIP24, -40…+71°С
595110408
 
DC-DC, 5Вт, Uвх=9...36В, Uвых=15В/400мА, изоляция 1500В DC, DIP24, -40…+71°С
595110409
 
DC-DC, 7,5Вт, Uвх=9...18В, Uвых=5В/1,5А, изоляция 1500В DC, DIP24, -40…+71°С
595110410
 
DC-DC, 15Вт, Uвх=18 - 36В, Uвых=5В/3А, изоляция 1500В DC, 2"x1" (50.8х25.4х10.2мм), -25°С…+60°С
595110411
 
DC-DC, 15Вт, Uвх=18 - 36В, Uвых=±15В/±500мА, изоляция 1500В DC, 2"x1" (50.8х25.4х10.2мм), -25°С…+60°С
595110412
 
LVDS pin header evaluation adapter for congatec Thin Mini-ITX boards)
595110413
 
Thin Mini-ITX board based on Intel® Pentium® N3710 quad core processor with 1.6GHz up to 2.56GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L SODIMM memory interface.
595110415
 
Thin Mini-ITX board based on Intel® Atom™ x5-E8000 quad core processor with 1.04GHz up to 2.0GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L SODIMM memory interface.
595110416
 
Thin Mini-ITX board based on Intel® Core™ i3-6100U dual core processor with 2.3GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-U).
595110417
 
Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.
595110418
 
Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.
595110419
 
Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.
595110420
 
Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread.
595110421
 
Adapter card for serial COM port debug connection on the QEVAL MFG_NC header of the Qseven evaluation carrier QEVAL.
595110422
 
Standard heatspreader for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread.
595110423
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole
595110424
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole
595110425
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
595110426
 
Qseven module with ultra low power NXP ARM® Cortex® A9 dual core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package.Commercial temperature range.
595110427
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
595110428
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
595110429
 
Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
595110430
 
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.
595110431
 
COM Express Type 6 Compact module with Intel® Core™ i5-8365UE quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (15W).
595110432
 
COM Express Type 6 Compact module with Intel® Celeron® Processor 2980U dual core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface. Features legacy VGA display interface.
595110433
 
Standard passive cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded
595110434
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
595110435
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
595110436
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
595110437
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
595110438
 
Standard heatspreader with 1mm gap pad for Qseven module conga-UMX6 with processors with LIDDED FCBGA package (PN: 016212).
595110439
 
Standard heatspreader with heat stack solution for Qseven module conga-UMX6 for processors with open silicon FCBGA package (PN: 016202).
595110440
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core Lite 800MHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
595110441
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Single Core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
595110442
 
Панель DIP 8 конт. шаг 2.54 мм (цанговая), на плату (W=7.62 мм), позол. (DS1001-01-08BT1NSF6X) (аналог SCSM-8)
595110443
 
Панель DIP 20 конт. шаг 2.54 мм (цанговая), на плату (W= 7.62 мм), с центр. перегородкой, позол. (DS1001-01-20BT1NSF6S) (аналог SCSM-20/ TRS-20)
595110444
 
Панель DIP 28 конт. шаг 2.54 мм (цанговая), на плату (W= 15.24 мм), позол. (DS1001-01-28BT1WSF6S) (аналог SCLM-28/ TRL-28)
595110445
 
Панель однорядная SIP 40 конт. шаг 2.54 мм (цанговая), вертик. на плату, Hизол. = 3.0 мм (Hобщ. = 7.4 мм), позол.цанг., сегмент. (DS1002-01-1*40V13-JK)
595110446
 
Панель двухрядная SIP 26 конт.(2x13) шаг 2.54 мм (цанговая), вертик., поверхностный монтаж на плату, Hизол.=3.0 мм (Hобщ.= 5.6 мм), позол.цанг., сегмент.
595110447
 
Панель двухрядная SIP 8 конт.(2x4) шаг 2.54 мм (цанговая), прямой угол на плату, Hизол.= 7.0 мм, позол.цанг., сегмент.
595110448
 
Панель двухрядная SIP 14 конт.(2x7) шаг 2.54 мм (цанговая), прямой угол на плату, Hизол.= 7.0 мм, позол.цанг., сегмент.
595110449
 
Адаптер SIP двухрядн. 8 конт. (2x4) шаг 2.54 мм, диам. 0.5/0.46 мм (H = 7.62 мм = 3.1 + 1.7изол. + 2.82 мм), вертик. на плату, поз.к.ч.10u", сегмент., до 60В/3А
595110450
 
Адаптер SIP однорядн. 10 конт. (1x10) шаг 2.54 мм, диам. 0.6/0.46 мм (H = 11.96 мм = 3.0 + 5.0 + 3.96 мм), вертик. на плату, позол.к.ч., сегмент. (DS1004-1*10F12-B)
595110451
 
Адаптер SIP однорядн. 20 конт. (1x20) шаг 2.54 мм, диам. 0.46/0.46 мм (H = 10.0 мм = 3.6 + 3.6 + 2.8 мм), вертик. на плату, позол.к.ч., сегмент. (аналог PSLM-20 тип 1, H = 10.0 мм)
595110452