Радиокомпоненты по запросу

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AC-DC, 7Вт, вход 85…265V AC, 47…63Гц / 120...375V DC, выход 12В/0.63A, изоляция 3000V AC, пласт. корпус 58х45х18.5мм, -40…+71°С
593661561
 
AC-DC, 7Вт, вход 85…265V AC, 47…63Гц / 120...375V DC, выход ±12В/±0.32A, изоляция 3000V AC, пласт. корпус 58х45х18.5мм, -40…+71°С
593661562
 
AC-DC, 7Вт, вход 85…265V AC, 47…63Гц / 120...375V DC, выход ±15В/±0.25A, изоляция 3000V AC, пласт. корпус 58х45х18.5мм, -40…+71°С
593661563
 
AC-DC, 10Вт, вход 85…265V AC, 47…63Гц / 120...375V DC, выход ±15В/±0.335A, изоляция 3000V AC, пласт. корпус 76.2х50.8х22.8мм, -40…+71°С
593661564
 
AC-DC, 15Вт, вход 85…265V AC, 47…63Гц / 120...375V DC, выход 15В/1A, изоляция 3000V AC, пласт. корпус 76.2х50.8х22.8мм, -40…+71°С
593661565
 
AC-DC, 15Вт, вход 85…265V AC, 47…63Гц / 120...375V DC, выход ±15В/±0.5A, изоляция 3000V AC, пласт. корпус 76.2х50.8х22.8мм, -40…+71°С
593661566
 
DC-DC, 5Вт, Uвх=9 - 18В, Uвых=±5В/500мА, изоляция 1500В DC, DIP24, -25°С…+71°С, без сертификатов
593661567
 
DC-DC, 5Вт, Uвх=9...36В, Uвых=±5В/±500мА, изоляция 1500В DC, DIP24, -40…+71°С
593661568
 
DC-DC, 5Вт, Uвх=9 - 18В, Uвых=5В/1А, изоляция 1500В DC, DIP24, -25°С…+71°С, без сертификатов
593661569
 
DC-DC, 5Вт, Uвх=9 - 18В, Uвых=5В/1А, изоляция 1500В DC, DIP24, -25°С…+71°С, без сертификатов
593661570
 
DC-DC, 5Вт, Uвх=9...36В, Uвых=5В/1А, изоляция 1500В DC, DIP24, -40…+71°С
593661571
 
DC-DC, 5Вт, Uвх=18…36В, Uвых=±12В/250мА, изоляция 1500В DC, DIP24, -25°С…+71°С, без сертификатов
593661572
 
DC-DC, 5Вт, Uвх=9...36В, Uвых=12В/500мА, изоляция 1500В DC, DIP24, -40…+71°С
593661573
 
DC-DC, 5Вт, Uвх=9...36В, Uвых=15В/400мА, изоляция 1500В DC, DIP24, -40…+71°С
593661574
 
DC-DC, 7,5Вт, Uвх=9...18В, Uвых=5В/1,5А, изоляция 1500В DC, DIP24, -40…+71°С
593661575
 
DC-DC, 15Вт, Uвх=18 - 36В, Uвых=5В/3А, изоляция 1500В DC, 2"x1" (50.8х25.4х10.2мм), -25°С…+60°С
593661576
 
DC-DC, 15Вт, Uвх=18 - 36В, Uвых=±15В/±500мА, изоляция 1500В DC, 2"x1" (50.8х25.4х10.2мм), -25°С…+60°С
593661577
 
LVDS pin header evaluation adapter for congatec Thin Mini-ITX boards)
593661578
 
Thin Mini-ITX board based on Intel® Pentium® N3710 quad core processor with 1.6GHz up to 2.56GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L SODIMM memory interface.
593661580
 
Thin Mini-ITX board based on Intel® Atom™ x5-E8000 quad core processor with 1.04GHz up to 2.0GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L SODIMM memory interface.
593661581
 
Thin Mini-ITX board based on Intel® Core™ i3-6100U dual core processor with 2.3GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-U).
593661582
 
Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.
593661583
 
Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.
593661584
 
Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.
593661585
 
Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread.
593661586
 
Adapter card for serial COM port debug connection on the QEVAL MFG_NC header of the Qseven evaluation carrier QEVAL.
593661587
 
Standard heatspreader for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread.
593661588
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole
593661589
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole
593661590
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
593661591
 
Qseven module with ultra low power NXP ARM® Cortex® A9 dual core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package.Commercial temperature range.
593661592
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
593661593
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
593661594
 
Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
593661595
 
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.
593661596
 
COM Express Type 6 Compact module with Intel® Core™ i5-8365UE quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (15W).
593661597
 
COM Express Type 6 Compact module with Intel® Celeron® Processor 2980U dual core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface. Features legacy VGA display interface.
593661598
 
Standard passive cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded
593661599
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
593661600
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
593661601
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
593661602
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
593661603
 
Standard heatspreader with 1mm gap pad for Qseven module conga-UMX6 with processors with LIDDED FCBGA package (PN: 016212).
593661604
 
Standard heatspreader with heat stack solution for Qseven module conga-UMX6 for processors with open silicon FCBGA package (PN: 016202).
593661605
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core Lite 800MHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
593661606
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Single Core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
593661607
 
Заглушка для разъема "гнездо" 8P8C (RJ-45), черный PVC изол. (фланец 11.1 x 13.8 мм)
593661608