Радиокомпоненты по запросу

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Standard heatspreader for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread.
598133275
 
Qseven module with Intel® Celeron™ N3060 dual core processor with 1.60GHz core frequency up to 2.48GHz burst, 2MB L2 cache, 2GB 1600MT/s DDR3L onboard memory and 8GB eMMC onboard flash.
598133276
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole
598133277
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole
598133278
 
Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
598133279
 
Qseven module with ultra low power NXP ARM® Cortex® A9 dual core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package.Commercial temperature range.
598133280
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
598133281
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
598133282
 
Qseven module with ultra low power NXP ARM® Cortex® A9 single core 800MHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package. Industrial grade temperature range from -40°C to 85°C.
598133283
 
Qseven module with ultra low power NXP ARM® Cortex® A9 quad core 1GHz processor with 1MB L2 cache, 2GB onboard DDR3L memory and 8GB onboard eMMC. Open silicon FCBGA package. Commercial temperature range.
598133284
 
Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
598133285
 
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
598133286
 
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.
598133287
 
COM Express Type 6 Compact module with Intel® Core™ i5-8365UE quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (15W).
598133288
 
COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial temperature range.
598133289
 
COM Express Type 6 Compact module with Intel® Celeron® Processor 2980U dual core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface. Features legacy VGA display interface.
598133290
 
Standard passive cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded
598133291
 
Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
598133292
 
Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
598133293
 
eDP to standard HDMI evaluation adapter for congatec Thin Mini-ITX boards.
598133294
 
Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
598133295
 
Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are M2.5mm thread.
598133296
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
598133297
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
598133298
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
598133299
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
598133300
 
Standard heatspreader with 1mm gap pad for Qseven module conga-UMX6 with processors with LIDDED FCBGA package (PN: 016212).
598133301
 
Standard heatspreader with heat stack solution for Qseven module conga-UMX6 for processors with open silicon FCBGA package (PN: 016202).
598133302
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core Lite 800MHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
598133303
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Single Core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
598133304
 
Радиатор для модулей conga-QA6; крепежные отверстия 2,7 мм без резьбы
598133305
 
Радиатор для модулей conga-XAF; крепежные отверстия M2,5
598133306
 
Astro Carrier Board for NVIDIA® Jetson™ TX2i/TX2/TX2-4GB
598133307
 
Cogswell Carrier Board for NVIDIA® Jetson™TX2/TX2i
598133308
 
10pin header to 1 x DB-9 male serial cable
598133309
 
Micro USB to USB Type-A Male
598133310
 
Misc. I/O cable, 2 x 6 Pin Header to flying leads
598133311
 
Cable Kit for Astro Breakout Board (XBG201/XBG206).  1x CBG118- 8-pin MiniTek w/ Latch, 1x CBG190- 10-pin MiniTek w/Latch, 1x CBG111- 10-pin MiniTek w/ Latch, 1x CBG136- RTC battery, 1x CBG112- 6-pin MiniTek w/ Latch
598133312
 
Миниатюрная несущая плата для модулей NVIDIA Jetson Nano, TX2 NX и Xavier NX. Идеально подходит для таких применений как машинного зрение, беспилотный транспорт и т п .
598133313
 
Миниатюрная несущая плата для модулей NVIDIA Jetson Nano, TX2 NX и Xavier NX. Идеально подходит для таких применений как машинного зрение, беспилотный транспорт и т п .
598133314
 
Astro Breakout Board for NVIDIA® Jetson™ TX2
598133315
 
Active Thermal Heatsink for the NVIDIA® Jetson™ TX2
598133316
 
Thermal plate for NVIDIA® Jetson Nano™ Module
598133317
 
Панель DIP 8 конт. шаг 2.54 мм (цанговая), на плату (W=7.62 мм), позол. (DS1001-01-08BT1NSF6X) (аналог SCSM-8)
598133318
 
Панель DIP 20 конт. шаг 2.54 мм (цанговая), на плату (W= 7.62 мм), с центр. перегородкой, позол. (DS1001-01-20BT1NSF6S) (аналог SCSM-20/ TRS-20)
598133319
 
Панель DIP 28 конт. шаг 2.54 мм (цанговая), на плату (W= 15.24 мм), позол. (DS1001-01-28BT1WSF6S) (аналог SCLM-28/ TRL-28)
598133320
 
Панель двухрядная SIP 26 конт.(2x13) шаг 2.54 мм (цанговая), вертик., поверхностный монтаж на плату, Hизол.=3.0 мм (Hобщ.= 5.6 мм), позол.цанг., сегмент.
598133321
 
Панель двухрядная SIP 8 конт.(2x4) шаг 2.54 мм (цанговая), прямой угол на плату, Hизол.= 7.0 мм, позол.цанг., сегмент.
598133322