Радиокомпоненты по запросу

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Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
595323770
 
Qseven module with ultra low power NXP ARM® Cortex® A9 dual core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package.Commercial temperature range.
595323771
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
595323772
 
Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
595323773
 
Qseven module with ultra low power NXP ARM® Cortex® A9 single core 800MHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package. Industrial grade temperature range from -40°C to 85°C.
595323774
 
Qseven module with ultra low power NXP ARM® Cortex® A9 quad core 1GHz processor with 1MB L2 cache, 2GB onboard DDR3L memory and 8GB onboard eMMC. Open silicon FCBGA package. Commercial temperature range.
595323775
 
Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
595323776
 
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
595323777
 
Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.
595323778
 
COM Express Type 6 Compact module with Intel® Core™ i5-8365UE quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (15W).
595323779
 
COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial temperature range.
595323780
 
COM Express Type 6 Compact module with Intel® Celeron® Processor 2980U dual core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface. Features legacy VGA display interface.
595323781
 
Standard passive cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded
595323782
 
Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
595323783
 
Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
595323784
 
eDP to standard HDMI evaluation adapter for congatec Thin Mini-ITX boards.
595323785
 
Standard active cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
595323786
 
Standard heatspreader for high performance COM Express module conga-TR3 with integrated heat pipes. All standoffs are M2.5mm thread.
595323787
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
595323788
 
Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
595323789
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
595323790
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
595323791
 
Standard heatspreader with 1mm gap pad for Qseven module conga-UMX6 with processors with LIDDED FCBGA package (PN: 016212).
595323792
 
Standard heatspreader with heat stack solution for Qseven module conga-UMX6 for processors with open silicon FCBGA package (PN: 016202).
595323793
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core Lite 800MHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C.
595323794
 
Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Single Core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.
595323795
 
Радиатор для модулей conga-QA6; крепежные отверстия 2,7 мм без резьбы
595323796
 
Радиатор для модулей conga-XAF; крепежные отверстия M2,5
595323797
 
Astro Carrier Board for NVIDIA® Jetson™ TX2i/TX2/TX2-4GB
595323798
 
Cogswell Carrier Board for NVIDIA® Jetson™TX2/TX2i
595323799
 
10pin header to 1 x DB-9 male serial cable
595323800
 
Micro USB to USB Type-A Male
595323801
 
Misc. I/O cable, 2 x 6 Pin Header to flying leads
595323802
 
Cable Kit for Astro Breakout Board (XBG201/XBG206).  1x CBG118- 8-pin MiniTek w/ Latch, 1x CBG190- 10-pin MiniTek w/Latch, 1x CBG111- 10-pin MiniTek w/ Latch, 1x CBG136- RTC battery, 1x CBG112- 6-pin MiniTek w/ Latch
595323803
 
Миниатюрная несущая плата для модулей NVIDIA Jetson Nano, TX2 NX и Xavier NX. Идеально подходит для таких применений как машинного зрение, беспилотный транспорт и т п .
595323804
 
Миниатюрная несущая плата для модулей NVIDIA Jetson Nano, TX2 NX и Xavier NX. Идеально подходит для таких применений как машинного зрение, беспилотный транспорт и т п .
595323805
 
Astro Breakout Board for NVIDIA® Jetson™ TX2
595323806
 
Active Thermal Heatsink for the NVIDIA® Jetson™ TX2
595323807
 
Thermal plate for NVIDIA® Jetson Nano™ Module
595323808
 
Панель DIP 8 конт. шаг 2.54 мм (цанговая), на плату (W=7.62 мм), позол. (DS1001-01-08BT1NSF6X) (аналог SCSM-8)
595323809
 
Панель DIP 20 конт. шаг 2.54 мм (цанговая), на плату (W= 7.62 мм), с центр. перегородкой, позол. (DS1001-01-20BT1NSF6S) (аналог SCSM-20/ TRS-20)
595323810
 
Панель DIP 28 конт. шаг 2.54 мм (цанговая), на плату (W= 15.24 мм), позол. (DS1001-01-28BT1WSF6S) (аналог SCLM-28/ TRL-28)
595323811
 
Панель однорядная SIP 40 конт. шаг 2.54 мм (цанговая), вертик. на плату, Hизол. = 3.0 мм (Hобщ. = 7.4 мм), позол.цанг., сегмент. (DS1002-01-1*40V13-JK)
595323812
 
Панель двухрядная SIP 26 конт.(2x13) шаг 2.54 мм (цанговая), вертик., поверхностный монтаж на плату, Hизол.=3.0 мм (Hобщ.= 5.6 мм), позол.цанг., сегмент.
595323813
 
Панель двухрядная SIP 8 конт.(2x4) шаг 2.54 мм (цанговая), прямой угол на плату, Hизол.= 7.0 мм, позол.цанг., сегмент.
595323814
 
Панель двухрядная SIP 14 конт.(2x7) шаг 2.54 мм (цанговая), прямой угол на плату, Hизол.= 7.0 мм, позол.цанг., сегмент.
595323815
 
Адаптер SIP двухрядн. 8 конт. (2x4) шаг 2.54 мм, диам. 0.5/0.46 мм (H = 7.62 мм = 3.1 + 1.7изол. + 2.82 мм), вертик. на плату, поз.к.ч.10u", сегмент., до 60В/3А
595323816
 
Адаптер SIP однорядн. 10 конт. (1x10) шаг 2.54 мм, диам. 0.6/0.46 мм (H = 11.96 мм = 3.0 + 5.0 + 3.96 мм), вертик. на плату, позол.к.ч., сегмент. (DS1004-1*10F12-B)
595323817