conga-SA5/CSP-B, p/n 050055
Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
Беларусь: Минск, ул. Сурганова, д.5а пом. 3
Время работы: пн.-пт. с 9.00-17.00;
e-mail: chip@neocomponent.com
Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.