SoC XCZU19EG-3FFVD1760E
Товар отсутствует на складе.
Товар можно оформить под заказ.
Architecture | MCU, FPGA |
Connectivity | CANbus, EBI/EMI, Ethernet, IВІC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Flash size | - |
Operating temperature | 0В°C ~ 100В°C (TJ) |
Package / case | 1760-BBGA, FCBGA |
Packaging | Tray |
Part status | Active |
Peripherals | DMA, WDT |
Primary attributes | ZynqВ®UltraScale+в„ў FPGA, 1143K+ Logic Cells |
Ram size | 256KB |
Speed | 600MHz, 667MHz, 1.5GHz |
Supplier device package | 1760-FCBGA (42.5x42.5) |
Производитель | Xilinx Inc. |